Memory, Chipset & Other Cooling

Fans & Accessories
Ref: 254

Our full range of case fans are available at the link below,

» Fans & Accessories
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Fan Power Converter
Ref: 306

4 pin molex to 3 pin adapter which reduces the 12v feed to the fan to reduce noise. Will also reduce airflow.

Once you have one of these adapters, any further STANDARD 4pin to 3pin adapters that are connected onto the passthru connector will also run at the reduced voltage.

Please note, these adapters should NEVER be connected to any device other than fans.

Please note, O-CuK can accept no responsibility or liability for damage which may result in the use of this product.

Price: £1.20 exc VAT
(£1.41 Including VAT at 17.5%)

Swiftech MC14 BGA Ramsinks (8 pack)
Ref: 251

The MC14 is a BGA memory Ramsink optimized for convection cooling of memory components such as those found in graphic cards. It is the ideal companion to our VGA liquid cooling solutions thus allowing high-end graphic cards to operate in virtual silence.

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Price: £12.00 exc VAT
(£14.10 Including VAT at 17.5%)

Zalman ZM-RHS1 Aluminium Ramsinks (8 pack)
Ref: 215

• Zalman RAMSinks are aluminum with a lot of surface area! they are ready to install with the attached thermal trasfer material. Just peal off the protective layer and install on video card!
• RAMSinks are designed to provide optimal heat dissipation when used on video card memory and small system components.
• With a video card overclocked (and used with watercooling), the Zalman RAMSinks will achieve better system stability and greater performance.
• RAMsink dimesions are 4 at: 13(L) x 13(W) x 13(H)mm and 4 at 13(L) x 13(W) x 6(H)mm.
• Package of Eight (8).

MicroCool SouthSink *CLEARANCE*
Ref: 14

ChipSink is a complete family of passive heat dissipators, studied specifically for the correct cooling process for integrated motherboard chips, such as: frequency generators (PLL), power supply regulators (MOSFET), chipsets that control the peripherals (SouthBridge) and integrated controllers (RAID, SATA).

Microcool has developed these dissipators so that they are easily installable over the seated motherboard components, that are generally lacking adequate cooling systems at the time of purchase, and that are always subject to intense heat during system overclocking and overvoltaging.

The high quality thermally conductive adhesives allow rapid application and maximum thermal transfer. The surface treatment of anodized aluminum guarantees electrical insulation and maximum heat dissipation for dispersal

• Technical specifications for ChipSink:
• Dissipator material: 6063 extruded aluminium
• Heat conducting adhesive: Chomerics T405
• Dimensions of Southsink dissipator: 30(L)x30(W)x30(H) mm